Chinotonhorera che micro thermoelectric (Micro TEC), chinonziwo micro thermoelectric cooling module, Micro-peltier module, Micro peltier element, chave chichishandiswa zvakanyanya muzvikamu zvakasiyana-siyana zvetekinoroji yepamusoro nekuda kwehunhu hwayo hwakasiyana uye kushanda kwayo zvakanaka muinjiniya.

Micro thermoelectric cooler (Micro TEC), inonziwo micro thermoelectric cooling module, Micro-peltier module, Micro peltier element, yave ichishandiswa zvakanyanya muzvikamu zvakasiyana-siyana zvetekinoroji yepamusoro nekuda kwehunhu hwayo hwakasiyana uye hunyanzvi hwayo hwepamusoro. Mashandisirwo ayo makuru anowanikwa munzvimbo dzinoda zvinodiwa zvakasimba pakushanda—kusanganisira kugadzikana kwekupisa, kukurumidza kupisa, kugadzikana kwenzvimbo, uye kukwirirana kwemagetsi—kusanganisira kutaurirana kwemaziso, midziyo yemagetsi yevatengi, michina yekurapa, midziyo yemagetsi yemotokari, masisitimu emuchadenga nekudzivirira, uye michina yemagetsi inoshanda nemaindasitiri.

I. Kutaurirana Kwemaziso (Kushandiswa Kwepfungwa Dzakakosha)

Micro TECs, Micro thermoelectric modules, Micro peltier devices dzinoshanda sezvikamu zvakakosha zvekudzora tembiricha yema lasers muma transceivers e high-speed optical (semuenzaniso, 10G, 25G, 100G, 400G, uye 800G modules). Nekuchengetedza tembiricha ye laser junction mukati me ±0.1°C, zvinodzivirira wavelength drift uye inter-channel crosstalk, nokudaro zvichivimbisa kusimba kwesignal uye kuvimbika mukutumira data re high-bandwidth. Kuwedzera kwekuda kwe low-latency, high-throughput optical interconnects—kuchitungamirirwa neAI-intensive computing infrastructure munzvimbo dzedata uye AI training clusters—kwakakurumidzisa kukura kwemusika weMicro TEC (micro peltier module). Kunyange hazvo mhinduro dzepamusoro dzichiri kutungamirwa nevatungamiriri vepasi rose vakaita saFerrotec naKELK, vagadziri vemuno vari kuita kufambira mberi kwakasimba mukusimudzira thermoelectric material systems, hermetic packaging technologies, uye system-level integration capabilities, zvichiita kuti zvikwanisike kuti ma supply chains awane nzvimbo zvishoma nezvishoma asi zvichienderera mberi.

II. Zvigadzirwa zvemagetsi zvevatengi

MaMicro TEC, maMicro thermoelectric cooling modules (miniature peltier module) ari kushandiswa zvakanyanya mukugadzirisa kupisa kwemidziyo inotakurika uye midiki—kusanganisira ma clamp ekutonhodza emafoni, ma desktop thermoelectric water dispensers (anopisa/anotonhora), ma micro-scale PCR instruments, uye ma mini-refrigerators anofambiswa ne USB. Magadzirirwo awo e solid-state—anoratidzwa ne zero moving parts, regligible vibration, ultra-low acoustic noise, uye sub-millimeter form factors—anoenderana zvakanyanya ne key design intensities mu consumer electronics: miniaturization, silent operation, uye seamlessly integratement.

III. Zvishandiso zveBiomedical

Kuongororwa kwemuviri nemuviri (IVD) uye mapuratifomu esainzi yehupenyu anotsigira maMicro thermoeletric modules, Micro peltier elements, Micro TECs, miniature peltier elements kuti pave nekutonga kwakarurama uye kwakasimba kwekupisa:

(1) Mumasystem e real-time quantitative polymerase chain reaction (qPCR), Micro TECs, Micro thermoelectric modules (Micro TEC modules) dzinogonesa millisecond-scale thermal cycling (chiyero chekupisa ≥ 3°C/s; chiyero chekutonhodza ≥ 2°C/s), zvichiita kuti amplification ive chaiyo uye assay reproducibility;

(2) Matangi ekutakura anotakurika emishonga nemajekiseni anochengetedza nzvimbo dzakagadzikana dzekushanda kwe2–8°C, zvichizadzisa zvinodiwa neWHO zvekutanga zvekutakura zvinhu zvinodzorwa nekupisa;

(3) Mukuongorora hematology uye makemikari ekiriniki, kutonhora kweCCD/CMOS image sensors (nzvimbo yekushanda: −10°C kusvika +5°C) kunoderedza zvakanyanya ruzha rwerima uye kunowedzera chiyero chesignal-to-noise;

(4) Muzvishandiso zvekurapa zvinoyevedza—zvinosanganisira masisitimu ekubvisa bvudzi achishandisa laser uye mapuratifomu echiedza chakasimba (IPL)—Micro peltier coolers, Micro TECs, micro thermoelectric cooling modules, zvinopa kutonhora kweganda kuti zvivandudze kuchengetedzeka kwekurapa, kushanda zvakanaka, uye kunyaradzwa kwemurwere.

IV. Zvigadzirwa zvemagetsi zveMotokari

Nekuwanda kwemotokari dzakabatana dzakangwara uye masisitimu ekubatsira vatyairi epamusoro (ADAS), maMicro TEC modules, maMicro TECs, maMinitary thermoelectric modules anoshandiswa pakugadzirisa kupisa mumayuniti eLiDAR transmitter/receiver, zvichiita kuti optical ishande zvakanaka mumamiriro ezvinhu akaoma (−40°C kusvika +85°C). Akabatanidzwawo muma subsystems ekudzora mamiriro ekunze emumba, akadai semafiriji akangwara akaiswa mumotokari. Ane 12 V DC input, simba shoma rinoshandiswa (< 5 W yakajairika), simba guru remakanika (rinodzivirira kudedera uye kuvhunduka), uye ultra-compact footprint (< 10 mm²), maMicro thermoelectric modules, maMicro peltier modules, maMicro thermoelectric cooling modules (mamicro thermoelectric modules) anosangana nekuvimbika kwakasimba kwemota uye zvinodiwa zvekugadzira nzvimbo.

V. Ndege neDziviriro

Micro TECs, Micro peltier devices zvakaratidza kushanda zvakanaka mu-orbit systems muma satellite payload thermal management systems. Semuenzaniso, mayuniti akagadzirwa munyika akasimbiswa mu "Lianjian-1" launch vehicle, zvichibvumira active thermal regulation ye mission-critical electronics - kusanganisira onboard optical communication modules uye high-sensitivity infrared focal plane arrays - munzvimbo yakaoma yemuchadenga. Pamusoro pezvo, vanotsigira airborne infrared detectors uye scientific-grade airborne CCD imaging systems, uko kugadzikana kwethermal kwakanyanya kukosha kuti high-resolution remote sensing uye kunyatsozivikanwa kwechinangwa.

VI. Zvishandiso Zvemaindasitiri Zvakanyatsonaka

Zvishandiso zvikuru zvinosanganisira:

(1) Kugadzikana kwekupisa kwe fiber uye ultrafast laser pombi masosi (kugadzikana ≤ ± 0.05°C), kuve nechokwadi chekuti simba rekubuda rinogara riripo uye kuti ray rakavimbika;

(2) Kutonhodza kwakanyanya kwe mercury cadmium telluride (MCT) kana HgCdTe infrared detectors muma thermal imagers nema spectroscopic analyzers (kusvika -40°C), zvichideredza zvakanyanya ruzha rwekupisa uye zvichivandudza kugona kuona;

(3) Kushanda kwemakamera eCMOS esainzi anoshandiswa pakuongorora zvinhu zvemuchadenga uye kuongorora defect ye semiconductor wafer, uko dark current yakaderera inobvumira nguva yakareba yekuratidzwa uye kuvimbika kwemufananidzo kwakanyanya;

(4) Mamodule ekudzivirira kutonhora kwemakabati emagetsi ari munzvimbo dzine hunyoro hwakawanda, achishandisa kutonhora kwenzvimbo kuti agadzirise dova uye ave nechokwadi chekuti mashandiro acho akavimbika kwenguva refu.

Kusasiyana kwehunyanzvi uye kusatsiviwa kweMicro TEC, micro thermoelectric module kunobva pamhedzisiro yePeltier yakasimba, iyo inopa zvakanakira zvekubatana:

• Kudzora kupisa kwakasimba kwakanyatsojeka: nguva yekupindura kwekupisa kwe milliseconds; kurongeka kwekutonga kwekupisa kwakadzikama kuri nani pane ± 0.1°C;

• Kushanda kwakanyarara, kusina kudedera: kusavapo kwezvinhu zvinotenderera kana zvinodzokorodza—zvakanakira kushandiswa kwemifananidzo, kunzwa, uye kufungidzira kwemaziso;

• Kushandiswa zvishoma uye kugona kupinza zvinhu: zvinoenderana nekurongedza chip-on-board (COB) uye kubatanidzwa kwemhepo mukati memidziyo, zvichiita kuti kudzorwa kwekupisa kwemukati kuitwe ne sub-millimeter;

• Kugara kwenguva refu kwezvakatipoteredza: kushanda pasina zvinopisa mufiriji; hapana kuburitswa kwezvinhu zvinoparadza ozone kana magasi anodziya pasi; kutevedzera zvizere mitemo yeRoHS neREACH.

Tsanangudzo yeTES2-2402T200

Tembiricha inopisa yedivi ndeye 27 C,

Mufananidzo mukuru: 1.4A,

Kana:1.98V

QMax：> 0.7 W

ACR: 1.35 ±0.1 Ω

Delta T yepamusoro: 99 C

Saizi: Saizi yehwaro: 6.6×6.6 mm, saizi yepamusoro 4X4mm,

Kureba: 4.9±0.1mm.

Waya: 28 AWG kureba kwewaya yesimbi: 45.7 mm